JOURNAL OF ELECTRONIC PACKAGING

來源：樹人論文網(wǎng) 瀏覽次數(shù)：361次

所屬分區(qū)：4區(qū)

周期：Quarterly

ISSN：1043-7398

影響因子：1.99

是否開源：No

年文章量：47

錄用比：容易

學(xué)科方向：工程：電子與電氣

研究方向：工程技術(shù)

通訊地址：ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990

官網(wǎng)地址：http://electronicpackaging.asmedigitalcollection.asme.org/journal.aspx

投稿地址：https://journaltool.asme.org/home/JournalDescriptions.cfm?JournalID=5&Journal=EP

網(wǎng)友分享經(jīng)驗：>12周，或約稿

JOURNAL OF ELECTRONIC PACKAGING雜志中文介紹

電子包裝雜志發(fā)表論文，使用實驗和理論(分析和計算機輔助)的方法、方法和技術(shù)來解決和解決在電子和光子學(xué)組件、設(shè)備和系統(tǒng)的分析、設(shè)計、制造、測試和操作中遇到的各種機械、材料和可靠性問題。

JOURNAL OF ELECTRONIC PACKAGING雜志英文介紹

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.